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印刷电路板维修与翻新工程

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PCB烧坏部位修复

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烧坏的电路板

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填补Via通孔

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扩展DUT部位

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镀金修复

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修复损坏的部位

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BGA DUT部位修复

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在过去 5 年中，完成了超过 100K 的 BGA锡球修复。 IC封装形式包括 BGA、QFN、QFP、SOIC等

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