Probe Card – Bok Opt Sdn Bhd

Products Scope

Application devices of vertical & cantilever probe card

System LSI
Mobile Dram
LDI (LCD Drive IC)
Nand-Flash
Flip-Chip & BGA

System LSI vertical probe card picture

PAD Array 8 Para

Probe Head

Assembly 8 Para

Assembly 4 Para

Probe Marks

Assembly 4 Para

Remarks: PAD size 50x50um, O/D50um, 4Parallel 236Pins and random selected probe marks are left, right, bottom and upper side.

Structure of vertical probe card

Interpose application
Over 60um pitch : MLC or MLO
< 60um pitch : Zedaon own products
Over 60um pitch : Rhodeo6
Under than 60um pitch : MEMs Cobra
Lower / Upper guilde materials: Silicon Nitride.